Alternative title: why my mini0806 was crashing and stopped working after a light drop.
Pulled out pads! Note that the blade I used to remove would cause other side of pads missing if I applied too much pressure.
My theory is following: the heat sink that bridges RAM and SoC is causing stress on these chips. Mostly because it is glued and not mechanically pressed against the chips. This is a very silly design flaw, if for example, only SoC would have the heat sink (like found on IP cameras) then there would not be any stresses. I don’t think RAM needs heat sinking on those things.
I am tempted to take dremel to my other mini and split the heat sink in two…